Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942369 | Thin semiconductor package for notched semiconductor die | Shutesh Krishnan, Sw Wang, How Kiat Liew, Fui Fui Tan | 2024-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942369 | Thin semiconductor package for notched semiconductor die | Shutesh Krishnan, Sw Wang, How Kiat Liew, Fui Fui Tan | 2024-03-26 |