Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154877 | Semiconductor wafer and method of ball drop on thin wafer with edge support ring | Michael J. Seddon, Kazuhiro Saito | 2024-11-26 |
| 12040295 | Semiconductor device with backmetal and related methods | Michael J. Seddon, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda, Yusheng LIN | 2024-07-16 |