Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170253 | Metal-free frame design for silicon bridges for semiconductor packages | Dae-Woo Kim, Sairam Agraharam | 2024-12-17 |
| 12142553 | Guard ring design enabling in-line testing of silicon bridges for semiconductor packages | Arnab Sarkar, Dae-Woo Kim | 2024-11-12 |
| 12142545 | Nested architectures for enhanced heterogeneous integration | Ravindranath V. Mahajan, Debendra Mallik, Digvijay A. Raorane | 2024-11-12 |
| 12113026 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2024-10-08 |
| 12074121 | Metal-free frame design for silicon bridges for semiconductor packages | Dae-Woo Kim, Sairam Agraharam | 2024-08-27 |
| 12057413 | Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost | Lijiang Wang, Jianyong Xie, Arghya Sain, Xiaohong Jiang, Kemal Aygun | 2024-08-06 |
| 12046568 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Andrew Collins, Jianyong Xie | 2024-07-23 |
| 12044888 | Silicon groove architectures and manufacturing processes for passive alignment in a photonics die | Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande | 2024-07-23 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2024-01-16 |