Issued Patents 2023
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848284 | Protective elements for bonded structures | Javier A. Delacruz, Rajesh Katkar | 2023-12-19 |
| 11842894 | Electrical redundancy for bonded structures | Rajesh Katkar | 2023-12-12 |
| 11837582 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar | 2023-12-05 |
| 11830845 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2023-11-28 |
| 11830804 | Over and under interconnects | Stephen L. Morein, Ilyas Mohammed, Rajesh Katkar, Javier A. Delacruz | 2023-11-28 |
| 11824046 | Symbiotic network on layers | Javier A. Delacruz, Rajesh Katkar | 2023-11-21 |
| 11817409 | Directly bonded structures without intervening adhesive and methods for forming the same | Rajesh Katkar, Ilyas Mohammed, Javier A. Delacruz | 2023-11-14 |
| 11804469 | Active bridging apparatus | Javier A. Delacruz, Rajesh Katkar | 2023-10-31 |
| 11764177 | Bonded structure with interconnect structure | — | 2023-09-19 |
| 11762200 | Bonded optical devices | Rajesh Katkar | 2023-09-19 |
| 11764189 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar | 2023-09-19 |
| 11749645 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi +1 more | 2023-09-05 |
| 11728273 | Bonded structure with interconnect structure | — | 2023-08-15 |
| 11721653 | Circuitry for electrical redundancy in bonded structures | Javier A. Delacruz, Jung Ko | 2023-08-08 |
| 11631647 | Integrated device packages with integrated device die and dummy element | — | 2023-04-18 |
| 11626363 | Bonded structures with integrated passive component | Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more | 2023-04-11 |
| 11610846 | Protective elements for bonded structures including an obstructive element | Javier A. Delacruz, Rajesh Katkar, Arkalgud R. Sitaram | 2023-03-21 |
| 11605614 | Correction die for wafer/die stack | — | 2023-03-14 |
| 11600542 | Cavity packages | Shaowu Huang, Javier A. Delacruz, Liang Wang, Rajesh Katkar | 2023-03-07 |