Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855064 | Techniques for processing devices | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2023-12-26 |
| 11749645 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba +1 more | 2023-09-05 |
| 11664357 | Techniques for joining dissimilar materials in microelectronics | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu | 2023-05-30 |
| 11652083 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Gaius Gillman Fountain, Jr. | 2023-05-16 |
| 11626363 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz +1 more | 2023-04-11 |