BL

Bongsub Lee

AT Adeia Semiconductor Bonding Technologies: 2 patents #14 of 21Top 70%
Overall (2023): #170,977 of 537,848Top 35%
2
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11749645 TSV as pad Guilian Gao, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more 2023-09-05
11728313 Offset pads over TSV Guilian Gao 2023-08-15