Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855064 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2023-12-26 |
| 11837582 | Molded direct bonded and interconnected stack | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2023-12-05 |
| 11791307 | DBI to SI bonding for simplified handle wafer | Chandrasekhar Mandalapu, Gaius Gillman Fountain, Jr. | 2023-10-17 |
| 11764189 | Molded direct bonded and interconnected stack | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2023-09-19 |
| 11749645 | TSV as pad | Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more | 2023-09-05 |
| 11728313 | Offset pads over TSV | Bongsub Lee | 2023-08-15 |
| 11652083 | Processed stacked dies | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2023-05-16 |