Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855064 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Guilian Gao | 2023-12-26 |
| 11791307 | DBI to SI bonding for simplified handle wafer | Chandrasekhar Mandalapu, Guilian Gao | 2023-10-17 |
| 11756880 | Interconnect structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2023-09-12 |
| 11749645 | TSV as pad | Guilian Gao, Bongsub Lee, Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more | 2023-09-05 |
| 11664357 | Techniques for joining dissimilar materials in microelectronics | Chandrasekhar Mandalapu, Laura Wills Mirkarimi | 2023-05-30 |
| 11652083 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Laura Wills Mirkarimi | 2023-05-16 |
| 11631586 | Heterogeneous annealing method | Paul M. Enquist | 2023-04-18 |
| 11552041 | Chemical mechanical polishing for hybrid bonding | Chandrasekhar Mandalapu, Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2023-01-10 |