Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855064 | Techniques for processing devices | Laura Wills Mirkarimi, Guilian Gao, Gaius Gillman Fountain, Jr. | 2023-12-26 |
| 11837596 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2023-12-05 |
| 11837582 | Molded direct bonded and interconnected stack | Guilian Gao, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2023-12-05 |
| 11764189 | Molded direct bonded and interconnected stack | Guilian Gao, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2023-09-19 |
| 11756880 | Interconnect structures | Gaius Gillman Fountain, Jr., Jeremy Alfred Theil | 2023-09-12 |
| 11749645 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Belgacem Haba, Laura Wills Mirkarimi +1 more | 2023-09-05 |
| 11742314 | Reliable hybrid bonded apparatus | Pawel Mrozek | 2023-08-29 |
| 11742315 | Die processing | — | 2023-08-29 |
| 11735523 | Laterally unconfined structure | — | 2023-08-22 |
| 11715730 | Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements | Min Tao, Liang Wang, Rajesh Katkar | 2023-08-01 |
| 11710718 | Structures and methods for low temperature bonding using nanoparticles | — | 2023-07-25 |
| 11694925 | Diffusion barrier collar for interconnects | Rajesh Katkar | 2023-07-04 |
| 11658173 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2023-05-23 |
| 11652083 | Processed stacked dies | Guilian Gao, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2023-05-16 |
| 11552041 | Chemical mechanical polishing for hybrid bonding | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Jeremy Alfred Theil | 2023-01-10 |