Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837596 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2023-12-05 |
| 11670615 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2023-06-06 |
| 11658173 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2023-05-23 |
| 11610846 | Protective elements for bonded structures including an obstructive element | Belgacem Haba, Javier A. Delacruz, Rajesh Katkar | 2023-03-21 |