Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837596 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2023-12-05 |
| 11830838 | Conductive barrier direct hybrid bonding | — | 2023-11-28 |
| 11658173 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2023-05-23 |
| 11631586 | Heterogeneous annealing method | Gaius Gillman Fountain, Jr. | 2023-04-18 |