Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837582 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Belgacem Haba, Rajesh Katkar | 2023-12-05 |
| 11804377 | Method for preparing a surface for direct-bonding | — | 2023-10-31 |
| 11764189 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Belgacem Haba, Rajesh Katkar | 2023-09-19 |
| 11756880 | Interconnect structures | Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr. | 2023-09-12 |
| 11552041 | Chemical mechanical polishing for hybrid bonding | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Cyprian Emeka Uzoh | 2023-01-10 |