Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837556 | Wire bonding method and apparatus for electromagnetic interference shielding | Javier A. Delacruz | 2023-12-05 |
| 11823906 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, William C. Plants, David Edward Fisch | 2023-11-21 |
| 11765822 | Printed circuit boards with meshed conductive structures | Dance Wu | 2023-09-19 |
| 11737207 | PCB RF noise grounding for shielded high-speed interface cable | Dance Wu | 2023-08-22 |
| 11711591 | Common-mode filtering for high-speed cable interface | Dance Wu | 2023-07-25 |
| 11711225 | Reduction of power-over-data-lines (PODL) filter parasitics for multi-gigabit ethernet | Dance Wu | 2023-07-25 |
| 11696426 | Automotive network communication devices and cabling with electromagnetic shielding | Dance Wu | 2023-07-04 |
| 11626363 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz +1 more | 2023-04-11 |
| 11600542 | Cavity packages | Javier A. Delacruz, Liang Wang, Rajesh Katkar, Belgacem Haba | 2023-03-07 |
| 11570887 | On-board integrated enclosure for electromagnetic compatibility shielding | Dance Wu | 2023-01-31 |