Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823906 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, Shaowu Huang, William C. Plants | 2023-11-21 |
| 11688776 | Transistor level interconnection methodologies utilizing 3D interconnects | Javier A. Delacruz | 2023-06-27 |
| 11599299 | 3D memory circuit | Javier A. Delacruz | 2023-03-07 |