Issued Patents 2023
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670519 | Redistribution structures for semiconductor packages and methods of forming the same | Hung-Jui Kuo, Chen-Hua Yu | 2023-06-06 |
| 11664323 | Semiconductor package and method | Po-Han Wang, Hung-Jui Kuo | 2023-05-30 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2023-05-02 |
| 11614413 | Back scattering inspection system and back scattering inspection method | Jianmin Li, Li Zhang, Yuanjing Li, Zhiqiang Chen, Hao Yu +6 more | 2023-03-28 |
| 11605607 | Semiconductor device and methods of manufacture | Hung-Chun Cho, Hung-Jui Kuo, Sih-Hao Liao | 2023-03-14 |
| 11600592 | Package | Tian Hu, Hung-Jui Kuo, Sih-Hao Liao | 2023-03-07 |
| 11594472 | Package structure and method of forming the same | Hung-Chun Cho, Hung-Jui Kuo, Sih-Hao Liao, Wei-Chih Chen | 2023-02-28 |
| 11573322 | Laser speed measuring method, control device and laser velocimeter | Jian Li, Shangmin Sun, Yongming Wang, Yanwei Xu, Weifeng Yu +1 more | 2023-02-07 |