Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830829 | Device, system and method for providing inductor structures | Mark Bohr, Doug B. Ingerly, Rajesh Kumar, Harish Krishnamurthy, Nachiket Desai | 2023-11-28 |
| 11824041 | Hyperchip | Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly | 2023-11-21 |
| 11817442 | Hybrid manufacturing for integrated circuit devices and assemblies | Abhishek A. Sharma, Mauro J. Kobrinsky, Doug B. Ingerly | 2023-11-14 |
| 11756886 | Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures | Abhishek A. Sharma, Mauro J. Kobrinsky, Doug B. Ingerly | 2023-09-12 |
| 11749663 | Device, method and system for providing a stacked arrangement of integrated circuit dies | Mark Bohr, Glenn J. Hinton, Rajesh Kumar | 2023-09-05 |
| 11690211 | Thin film transistor based memory cells on both sides of a layer of logic devices | Mauro J. Kobrinsky, Conor P. Puls, Kevin J. Fischer, Bernhard Sell, Abhishek A. Sharma +1 more | 2023-06-27 |
| 11652060 | Die interconnection scheme for providing a high yielding process for high performance microprocessors | Mark Bohr, Rajabali M. Koduri, Leonard NEIBERG, Altug Koker, Swaminathan Sivakumar | 2023-05-16 |
| 11569173 | Bridge hub tiling architecture | Andrew Collins, Digvijay A. Raorane, Ravindranath V. Mahajan, Sujit Sharan | 2023-01-31 |