Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652060 | Die interconnection scheme for providing a high yielding process for high performance microprocessors | Wilfred Gomes, Mark Bohr, Rajabali M. Koduri, Altug Koker, Swaminathan Sivakumar | 2023-05-16 |