Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652060 | Die interconnection scheme for providing a high yielding process for high performance microprocessors | Wilfred Gomes, Mark Bohr, Leonard NEIBERG, Altug Koker, Swaminathan Sivakumar | 2023-05-16 |
| 11553222 | Low latency wireless virtual reality systems and methods | Lei Zhang, Gabor Sines, Khaled Mammou, David Glen, Layla A. Mah +1 more | 2023-01-10 |