Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11757012 | Source and drain contact cut last process to enable wrap-around-contact | Andrew M. Greene, Dechao Guo, Tenko Yamashita, Robert R. Robison, Ardasheir Rahman | 2023-09-12 |
| 11710768 | Hybrid diffusion break with EUV gate patterning | Eric R. Miller, Indira Seshadri, Andrew M. Greene, Julien Frougier | 2023-07-25 |
| 11695057 | Protective bilayer inner spacer for nanosheet devices | Yao Yao, Ruilong Xie, Andrew M. Greene | 2023-07-04 |
| 11688741 | Gate-all-around devices with isolated and non-isolated epitaxy regions for strain engineering | Andrew M. Greene, Julien Frougier, Jingyun Zhang, Sung-Dae Suk, Ruilong Xie | 2023-06-27 |
| 11646306 | Co-integration of gate-all-around FET, FINFET and passive devices on bulk substrate | Julien Frougier, Andrew Gaul, Ruilong Xie | 2023-05-09 |
| 11621332 | Wraparound contact to a buried power rail | Ruilong Xie, Alexander Reznicek, Junli Wang | 2023-04-04 |
| 11615988 | FinFET devices | Kangguo Cheng, Theodorus E. Standaert, Junli Wang | 2023-03-28 |