Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854989 | Semiconductor package substrate and semiconductor package including the same | Dongho Kim, Hwan Pil Park, Choongbin Yim, Jungwoo Kim | 2023-12-26 |
| 11804477 | Semiconductor device having package on package structure and method of manufacturing the semiconductor device | Jeonghyun Lee, Jihwang Kim | 2023-10-31 |
| 11798889 | Methods of manufacturing semiconductor packages | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Kyoungsei Choi | 2023-10-24 |
| 11728230 | Semiconductor package and method of fabricating the same | Ji Hwang Kim, Dongho Kim, Jin-Woo Park | 2023-08-15 |
| 11710673 | Interposer and semiconductor package including the same | Choongbin Yim, Dongwook Kim, Hyunki Kim, Jihwang Kim, Sungkyu Park +2 more | 2023-07-25 |
| 11676949 | Semiconductor packages having supporting members | Taeseok Choi, Jihwang Kim | 2023-06-13 |
| 11658107 | Semiconductor package including an interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Eunhee Jung, Kyoungsei Choi | 2023-05-23 |
| 11581263 | Semiconductor package, and package on package having the same | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jungsoo Byun, Doohwan Lee +3 more | 2023-02-14 |