Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824029 | Semiconductor package structure | Chi-Han Chen | 2023-11-21 |
| 11798890 | Assembly structure and package structure | Cheng-Yuan KUNG | 2023-10-24 |
| 11784111 | Semiconductor device and method for manufacturing the same | Cheng-Yuan KUNG, Chin-Cheng Kuo, Wu Chou Hsu | 2023-10-10 |
| 11769712 | Semiconductor package structure and method for manufacturing the same | Hsiao-Yen Lee | 2023-09-26 |
| 11722220 | System comprising packaged optical devices | Chang-Yu Lin, Cheng-Yuan KUNG | 2023-08-08 |
| 11545427 | Capacitor bank structure and semiconductor package structure | Cheng-Yuan KUNG, Chien-Hua Chen, Teck-Chong Lee, Pao-Nan Lee, Hsin Hsiang Wang +2 more | 2023-01-03 |