Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798890 | Assembly structure and package structure | Hung-Yi Lin | 2023-10-24 |
| 11784111 | Semiconductor device and method for manufacturing the same | Hung-Yi Lin, Chin-Cheng Kuo, Wu Chou Hsu | 2023-10-10 |
| 11756896 | Semiconductor package structure including shielding layer contacting conductive contact | Meng-Wei Hsieh | 2023-09-12 |
| 11722220 | System comprising packaged optical devices | Chang-Yu Lin, Hung-Yi Lin | 2023-08-08 |
| 11594660 | Semiconductor device package | Tang-Yuan Chen, Meng-Wei Hsieh | 2023-02-28 |
| 11545427 | Capacitor bank structure and semiconductor package structure | Chien-Hua Chen, Teck-Chong Lee, Hung-Yi Lin, Pao-Nan Lee, Hsin Hsiang Wang +2 more | 2023-01-03 |