Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545427 | Capacitor bank structure and semiconductor package structure | Cheng-Yuan KUNG, Chien-Hua Chen, Teck-Chong Lee, Hung-Yi Lin, Hsin Hsiang Wang +2 more | 2023-01-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545427 | Capacitor bank structure and semiconductor package structure | Cheng-Yuan KUNG, Chien-Hua Chen, Teck-Chong Lee, Hung-Yi Lin, Hsin Hsiang Wang +2 more | 2023-01-03 |