Issued Patents 2023
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11827021 | Applying mold chase structure to end portion of fluid ejection die | Christopher A. Leonard, Anthony M. Fuller | 2023-11-28 |
| 11807523 | Three-dimensional features formed in molded panel | Devin Alexander Mourey, Michael G. Groh | 2023-11-07 |
| 11780227 | Molded structures with channels | Michael W. Cumbie, Michael G. Groh | 2023-10-10 |
| 11780226 | Fluid ejection devices | Michael G. Groh, Bo Song, Veronica Frances Burnett Krim | 2023-10-10 |
| 11745507 | Fluid ejection device with break(s) in cover layer | Michael W. Cumbie, Anthony M. Fuller | 2023-09-05 |
| 11721636 | Circuit die alignment target | Anthony M. Fuller, Michael W. Cumbie | 2023-08-08 |
| 11691431 | Fluid circulation and ejection | Si-lam Choy, Michael W. Cumbie | 2023-07-04 |
| 11691423 | Uniform print head surface coating | Michael G. Groh, Bo Song | 2023-07-04 |
| 11673107 | Sequential encapsulation of reagents | Viktor Shkolnikov | 2023-06-13 |
| 11666908 | Microfluidic package | Michael W. Cumbie | 2023-06-06 |
| 11654680 | Fluidic ejection dies with enclosed cross-channels | Si-Iam J. Choy, Michael W. Cumbie, Jeffrey R. Pollard | 2023-05-23 |
| 11642885 | Fluid ejection device including fluid output channel | Michael W. Cumbie | 2023-05-09 |
| 11637172 | Semiconductor device packages including an inductor and a capacitor | Teck-Chong Lee | 2023-04-25 |
| 11605877 | Semiconductor device package and method of manufacturing the same | Sheng-Chi Hsieh, Chen-Chao Wang, Teck-Chong Lee | 2023-03-14 |
| 11597646 | Microfluidic device with manifold | Devin Alexander Mourey, Michael W. Cumbie, Si-lam Choy | 2023-03-07 |
| 11597204 | Fluid ejection polymeric recirculation channel | Michael W. Cumbie, Si-Iam J. Choy | 2023-03-07 |
| 11583861 | Microfluidic devices | Viktor Shkolnikov, Michael W. Cumbie | 2023-02-21 |
| 11577456 | Molded panels | Michael W. Cumbie | 2023-02-14 |
| 11577252 | Thermally controlled reagent release | Viktor Shkolnikov | 2023-02-14 |
| 11565521 | Fluid ejection device with a portioning wall | Michael W. Cumbie | 2023-01-31 |
| 11559987 | Fluidic die with surface condition monitoring | Eric Martin, Daryl E. Anderson, James R. Przybyla, Diane R. Hammerstad | 2023-01-24 |
| 11548287 | Fluidic die assemblies with rigid bent substrates | Michael W. Cumbie | 2023-01-10 |
| 11541659 | Molded printhead | Silam J. Choy, Michael W. Cumbie, Devin Alexander Mourey | 2023-01-03 |
| 11545427 | Capacitor bank structure and semiconductor package structure | Cheng-Yuan KUNG, Teck-Chong Lee, Hung-Yi Lin, Pao-Nan Lee, Hsin Hsiang Wang +2 more | 2023-01-03 |
| 11541658 | Fluidic die with nozzle layer electrode for fluid control | Daryl E. Anderson, Eric Martin, James R. Przybyla | 2023-01-03 |