Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11827021 | Applying mold chase structure to end portion of fluid ejection die | Chien-Hua Chen, Christopher A. Leonard | 2023-11-28 |
| 11787180 | Corrosion tolerant micro-electromechanical fluid ejection device | Stanley Wang | 2023-10-17 |
| 11745507 | Fluid ejection device with break(s) in cover layer | Michael W. Cumbie, Chien-Hua Chen | 2023-09-05 |
| 11721636 | Circuit die alignment target | Michael W. Cumbie, Chien-Hua Chen | 2023-08-08 |
| 11642884 | Die for a printhead | Michael W. Cumbie, Scott A. Linn, James Michael Gardner | 2023-05-09 |
| 11639055 | Fluid ejection devices including contact pads | James Michael Gardner, Scott A. Linn, Michael W. Cumbie | 2023-05-02 |