Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11806710 | Semiconductor package structures and methods of manufacturing the same | Hsiao-Yen Lee, Ying-Te Ou, Chung-Hao Chen | 2023-11-07 |
| 11784110 | Semiconductor package and method for manufacturing the same | Chung-Hao Chen | 2023-10-10 |
| 11784111 | Semiconductor device and method for manufacturing the same | Cheng-Yuan KUNG, Hung-Yi Lin, Wu Chou Hsu | 2023-10-10 |
| 11631631 | Semiconductor device including via structure for vertical electrical connection | — | 2023-04-18 |