Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11806710 | Semiconductor package structures and methods of manufacturing the same | Ying-Te Ou, Chin-Cheng Kuo, Chung-Hao Chen | 2023-11-07 |
| 11769712 | Semiconductor package structure and method for manufacturing the same | Hung-Yi Lin | 2023-09-26 |