Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11806710 | Semiconductor package structures and methods of manufacturing the same | Hsiao-Yen Lee, Chin-Cheng Kuo, Chung-Hao Chen | 2023-11-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11806710 | Semiconductor package structures and methods of manufacturing the same | Hsiao-Yen Lee, Chin-Cheng Kuo, Chung-Hao Chen | 2023-11-07 |