Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11806710 | Semiconductor package structures and methods of manufacturing the same | Hsiao-Yen Lee, Ying-Te Ou, Chin-Cheng Kuo | 2023-11-07 |
| 11784110 | Semiconductor package and method for manufacturing the same | Chin-Cheng Kuo | 2023-10-10 |