Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837566 | Electronic device package and method for manufacturing the same | Mei-Ju Lu, Chang-Yu Lin, Jr-Wei LIN, Chih-Pin Hung | 2023-12-05 |
| 11824029 | Semiconductor package structure | Hung-Yi Lin | 2023-11-21 |