Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837566 | Electronic device package and method for manufacturing the same | Mei-Ju Lu, Chi-Han Chen, Chang-Yu Lin, Jr-Wei LIN | 2023-12-05 |
| 11777191 | Semiconductor device package and method of manufacturing the same | Cheng-Yu Ho, Sheng-Chi Hsieh | 2023-10-03 |
| 11742324 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Meng-Kai SHIH, Teck-Chong Lee, Shin-Luh TARNG | 2023-08-29 |
| 11621220 | Assembly structure and method for manufacturing the same | Yung-Shun Chang, Teck-Chong Lee, Chih-Yi Huang | 2023-04-04 |