Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508685 | Stacked semiconductor package | Jihwan Suh, Taehun Kim, Hyuekjae Lee, Jihwan Hwang, Sang Cheon Park | 2022-11-22 |
| 11488910 | Semiconductor package having redistribution layer | Young Kun Jee, Il Hwan Kim | 2022-11-01 |
| 11482554 | Semiconductor package and method of fabricating the same | Yungcheol Kong, Hyunsu Jun, Kyoungsei Choi | 2022-10-25 |
| 11315802 | Method for manufacturing semiconductor package having redistribution layer | Il Hwan Kim, Chung-Sun Lee | 2022-04-26 |
| 11302660 | Semiconductor devices and semiconductor packages including the same | Ju-Il Choi, Jin Ho An, Jongho Lee, Jeonggi Jin, Atsushi Fujisaki | 2022-04-12 |
| 11282792 | Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads | Young Kun Jee, Hae-Jung Yu, Sangwon Kim, Jongho Lee, Dae-Woo Kim +1 more | 2022-03-22 |
| 11227855 | Semiconductor package | Jang-woo Lee, Ji Hwang Kim, Jong Bo Shim, Young Kun Jee | 2022-01-18 |
| 11222873 | Semiconductor packages including stacked substrates and penetration electrodes | Joonho Jun, Sunkyoung Seo, Jongho Lee, Young Kun Jee | 2022-01-11 |