Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508685 | Stacked semiconductor package | Jihwan Suh, Un-Byoung Kang, Taehun Kim, Hyuekjae Lee, Jihwan Hwang | 2022-11-22 |
| 11362905 | Method and device for receiving data from a plurality of peripheral devices | Eun Jeong Jeong, Seong-Lyun Kim | 2022-06-14 |