Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508685 | Stacked semiconductor package | Jihwan Suh, Un-Byoung Kang, Taehun Kim, Hyuekjae Lee, Sang Cheon Park | 2022-11-22 |
| 11404395 | Semiconductor package including underfill material layer and method of forming the same | Taehun Kim, Jihwan Suh, Soyoun Lee, Hyuekjae Lee, Jiseok Hong | 2022-08-02 |
| 11362062 | Semiconductor package | Unbyoung Kang, Sangsick Park, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2022-06-14 |
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park +1 more | 2022-03-29 |
| 11244927 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong +1 more | 2022-02-08 |