Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469180 | Semiconductor device including an insulating material layer with concave-convex portions | Junyeong Heo, Donghoon Won | 2022-10-11 |
| 11362062 | Semiconductor package | Jihwan Hwang, Sangsick Park, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2022-06-14 |
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Myungsung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2022-03-29 |