Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469099 | Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages | Jungmin Ko, Hyeongmun Kang, Hyeonjun Song | 2022-10-11 |
| 11362062 | Semiconductor package | Jihwan Hwang, Unbyoung Kang, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2022-06-14 |