Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462462 | Semiconductor packages including a recessed conductive post | Jaekyung Yoo, Jaeeun Lee, Yeongkwon Ko | 2022-10-04 |
| 11362062 | Semiconductor package | Jihwan Hwang, Unbyoung Kang, Sangsick Park, Jihwan Suh, Soyoun Lee | 2022-06-14 |