Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538792 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Jin-Woo Park, Teak-Hoon Lee | 2022-12-27 |
| 11515226 | Semiconductor package and method of fabricating the same | Seunghun Shin, Junyeong Heo | 2022-11-29 |
| 11462462 | Semiconductor packages including a recessed conductive post | Jaekyung Yoo, Jaeeun Lee, Teakhoon Lee | 2022-10-04 |
| 11424172 | Semiconductor package | Seunghun Shin, Junyeong Heo | 2022-08-23 |
| 11239171 | Semiconductor device and semiconductor package including the same | Jaeeun Lee, Junyeong Heo | 2022-02-01 |