Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515226 | Semiconductor package and method of fabricating the same | Yeongkwon Ko, Junyeong Heo | 2022-11-29 |
| 11424172 | Semiconductor package | Yeongkwon Ko, Junyeong Heo | 2022-08-23 |
| 11393801 | Discrete decoupling capacitor and integrated circuit chip package including same | Jaejune Jang, Dukseo Park, Sunwoo PARK, Howoo Park | 2022-07-19 |