Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515226 | Semiconductor package and method of fabricating the same | Yeongkwon Ko, Seunghun Shin | 2022-11-29 |
| 11469180 | Semiconductor device including an insulating material layer with concave-convex portions | Unbyoung Kang, Donghoon Won | 2022-10-11 |
| 11424172 | Semiconductor package | Yeongkwon Ko, Seunghun Shin | 2022-08-23 |
| 11239171 | Semiconductor device and semiconductor package including the same | Yeongkwon Ko, Jaeeun Lee | 2022-02-01 |