Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538792 | Semiconductor package and method of fabricating the same | Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2022-12-27 |
| 11462462 | Semiconductor packages including a recessed conductive post | Jaeeun Lee, Yeongkwon Ko, Teakhoon Lee | 2022-10-04 |