Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538792 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2022-12-27 |
JL
Jayeon LEE
Overall (2022): #416,716 of 548,613Top 80%
1
Patents 2022