Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404395 | Semiconductor package including underfill material layer and method of forming the same | Jihwan Hwang, Taehun Kim, Jihwan Suh, Hyuekjae Lee, Jiseok Hong | 2022-08-02 |
| 11362062 | Semiconductor package | Jihwan Hwang, Unbyoung Kang, Sangsick Park, Jihwan Suh, Teakhoon Lee | 2022-06-14 |
| 11244927 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Jiseok Hong, Taehun Kim +1 more | 2022-02-08 |