Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404395 | Semiconductor package including underfill material layer and method of forming the same | Jihwan Hwang, Taehun Kim, Jihwan Suh, Soyoun Lee, Hyuekjae Lee | 2022-08-02 |
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2022-03-29 |
| 11251070 | Semiconductor device including a passivation spacer and method of fabricating the same | Chan Yoon, Ilyoung Moon, Jemin Park, Kiseok Lee, Jung-Hoon Han | 2022-02-15 |
| 11244927 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Soyoun Lee, Taehun Kim +1 more | 2022-02-08 |