Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469099 | Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages | Jungmin Ko, Hyeongmun Kang, Sangsick Park | 2022-10-11 |
| 11257794 | Semiconductor package and method of manufacturing the same | Eunkyul Oh, Hyeongmun Kang, Jungmin Ko | 2022-02-22 |