Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469099 | Semiconductor package with chip end design and trenches to control fillet spreading in stacked chip packages | Jungmin Ko, Sangsick Park, Hyeonjun Song | 2022-10-11 |
| 11257725 | Semiconductor package including test bumps | Taehyeong Kim, Seungduk Baek | 2022-02-22 |
| 11257794 | Semiconductor package and method of manufacturing the same | Hyeonjun Song, Eunkyul Oh, Jungmin Ko | 2022-02-22 |