Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495576 | Semiconductor package | Kyoungsoo Kim, Sunwon Kang, Ho-Geon Song, Kyung Suk Oh | 2022-11-08 |
| 11488894 | Semiconductor device having planarized passivation layer and method of fabricating the same | Young Lyong Kim | 2022-11-01 |
| 11257725 | Semiconductor package including test bumps | Taehyeong Kim, Hyeongmun Kang | 2022-02-22 |