Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532591 | Semiconductor package and method of fabricating the same | Eunseok Song | 2022-12-20 |
| 11495576 | Semiconductor package | Kyoungsoo Kim, Sunwon Kang, Seungduk Baek, Ho-Geon Song | 2022-11-08 |
| 11482509 | Semiconductor package | Se-Ho You, Sunkyoung Seo | 2022-10-25 |
| 11468928 | On-die termination of address and command signals | Ian Shaeffer | 2022-10-11 |
| 11469156 | Semiconductor package for discharging heat generated by semiconductor chip | Hyunki Kim, Sangsoo Kim, Seung Hwan Kim, Yongkwan Lee, Jongho Lee | 2022-10-11 |
| 11398454 | System-in-package module | Ae-Nee Jang, Eunseok Song, Seung-Yong Cha | 2022-07-26 |
| 11349478 | Integrated circuit that applies different data interface terminations during and after write data reception | Ian Shaeffer | 2022-05-31 |
| 11309280 | Semiconductor device package | Yong Hoon Kim, Kil-Soo Kim, Tae-Joo Hwang | 2022-04-19 |
| 11257723 | Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package | Do Hyun Kim, Sunwon Kang, Hogeon Song | 2022-02-22 |