Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532591 | Semiconductor package and method of fabricating the same | Kyung Suk Oh | 2022-12-20 |
| 11482516 | Semiconductor package and method of manufacturing the same | Kyungsuk Oh, Seho You | 2022-10-25 |
| 11398454 | System-in-package module | Ae-Nee Jang, Kyung Suk Oh, Seung-Yong Cha | 2022-07-26 |