Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508713 | Methods of manufacturing semiconductor package and package-on-package | Junyoung Oh, Kyonghwan Koh, Seunghwan KIM, Jongho Park, Yongkwan Lee | 2022-11-22 |
| 11469156 | Semiconductor package for discharging heat generated by semiconductor chip | Hyunki Kim, Seung Hwan Kim, Kyung Suk Oh, Yongkwan Lee, Jongho Lee | 2022-10-11 |
| 11412402 | Messaging devices and methods | John F. Nagel, J. Roy Pottle, Peter C. Barnett, David B. Andersen, Jamie Gordon Nichol | 2022-08-09 |